Solid state image device and defective pixel recording method thereof

ABSTRACT

The present invention makes it possible to easily and additionally write positional information of the defective pixel which is difficult to deal with using an automated writing mode, and that, without using any special writing jig in the case where a new defective pixel is occurred in a solid state image element. 
     Concretely, a solid state image device in which solid state image means of N lines in the vertical direction and M pixels in the horizontal direction is arranged in a matrix comprises display means for displaying a position of a defective pixel occurred at a solid state image means, position selection means manually operated so as to select the position of the defective pixel on the screen of this display means and memory means for memorizing positional information D 1  of the defective pixel selected by this position selection means. Therefore, if a new defective pixel is occurred in a solid state image means  11  after shipping the product, positional information which is difficult to deal with using the automated writing mode can be easily and additionally written, for example, in the service section without using any special writing jig.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a solid state image device and itsdefective pixel recording method which is applied to CCD cameraarranging a solid state image element in a matrix shape and in a highdensity and is preferable. More particularly, the present invention ischaracterized in that position selection means for selecting a positionof defective pixel on the screen is provided, this position selectionmeans is manually operated and positional information of selecteddefective pixel is recorded in the memory means, if a new defectivepixel is occurred in a solid state image element after shipping theproduct, without using any special jig for writing, in addition,positional information which is difficult to deal with by the automatedwriting mode has been made easily additionally written.

2. Description of the Related Art

Recently, there have been many cases where a video camera is used inwhich a solid state image element (CCD) is arranged in a high densityand in a matrix shape. In this kind of video camera, pixels which arenot normally operated in a certain rate (hereinafter, as referred todefective pixel) are generated and appeared as dotted fixed noises (socalled white and bright defect: white defect) on the screen. It isconsidered that this was occurred because pn junction of lightelectronic conversion element is destroyed or somehow done byintervention of cosmic rays and radiation on the way of traveling aftershipping the product or at the place where the camera is set. Therefore,there have been many cases where defective correction system forremoving its influence by adjusting white defect is mounted in CCDcamera.

According to the defective correction system 10 of the CCD camera 1shown in FIG. 1, a defective pixel recording method using one time ROMis employed, and an image acquisition information related to defectivepixel is adjusted by memorizing the adjusted data into ROM2. As forwhite defect which is occurred posteriorly, after existing ROM2 isremoved from the CCD camera in step B1 of flowchart shown in FIG. 2, anew ROM2 is set in the writing jig 3. Then, in step B3, the position ofdefective pixel is measured, and after that, in step B4, a correcteddata to an image acquisition information related to defective pixel isprepared, this is written into a new ROM2, and then, in step B5, theROM2 is removed from the writing jig 3 and mounted so as to exchangewith the old ROM2 set in the CCD camera 1.

Now, according to the defective correction system 10 using one time ROM,since it needs the writing jig 3 which is exclusive such as ROM writerand the like, burden is heavy from the point of view of facilities.Then, a method of mounting a non-volatile memory in the CCD camera,detecting a position related to defective pixel by scanning on thescreen with camera itself, and employing automatic writing mode in whichthe correction data prepared based on its positional information iswritten into a memory is designed.

However, white defect, which can be dealt with by automatic writingmode, may remain. For example, there is a problem that it is difficultto selectively correct white defect as repeating flickeringperiodically, and white defect and the like which cannot be deletedbecause of the limitation of defective correction system.

It should be noted that the limitation of defective correction system isoccurred in a case where correction number related to defective pixel onthe identical line is defined, refers to a fact that defective pixelexceeding over its correction number of pieces cannot be recorded.Moreover, white defect which could not be deleted due to the limitationof the defective correction system refers to a portion which is whiteand bright due to defective pixels exceeding over the correction numberof pieces on the same line.

SUMMARY OF THE INVENTION

The present invention is one, which has resolved such conventionalproblems, and an object of the present invention is to provide a solidstate image device and its defective pixel recording method in whichpositional information of defective pixel are capable of easily andadditionally being written without using any special writing jig, butare difficult to deal with by an automated writing mode in the casewhere a new defective pixel in a solid state image element is occurred.

The above described problem is solved by a solid state image device of Nlines in the vertical direction and M pixels in the horizontal directioncharacterized in that this solid state image device is arranged in amatrix shape, comprises display means for displaying a position ofdefective pixel occurred at a solid state image element, positionselection means manually operated so as to select a position ofdefective pixel on the screen of this display means and memory means formemorizing positional information of defective pixels selected by thisposition selection means.

According to the solid state image device of the present invention, inthe case where positional information of a defective pixel is newlyrecorded, the position of the defective pixel occurred in the solidstate image element is displayed on the screen by the display means. Theposition selection means is manually operated so as to select theposition of the defective pixel on the screen of this display means.

For example, the horizontal cursor is manually operated in the verticaldirection on the screen of the display means and the vertical cursor isoperated in the horizontal direction on the screen. Manually operated sothat the writing determination button is pressed at the intersection ofthe horizontal cursor and the vertical cursor. The positionalinformation of the selected defective pixel is recorded in the memorymeans by this position selection means.

Accordingly, in the case where a new defective pixel is occurred in thesolid state image element after shipping the product, positionalinformation of a defective pixel, which is difficult to deal with inautomated writing mode, can be easily written into the memory means in,for example, the service section without using any special writing jig.

A defective pixel recording method of a solid state image device of thepresent invention is a recording method of a defective pixel in thesolid state image device in which a solid state image element of N linesin the vertical direction and M pixels in the horizontal directionarranged in a matrix shape, characterized in that a position of adefective pixel occurred in a solid state image element is displayed onthe screen, the position of the defective pixel is selected by manualoperation and the positional information of the defective pixel whichhas been selected here is recorded in the memory means.

According to a defective pixel recording method of a solid state imagedevice of the present invention, since the manual writing modedetermining the writing is carried out, for example, by superimposingthe intersection of the horizontal cursor and the vertical cursor on theposition of the defective pixel on the screen, in the case where a newdefective pixel is occurred in the solid state image element aftershipping the product, the positional information can be easily writtenin the memory means without using any special writing jig. Accordingly,as for a defective pixel occurred posteriorly, it can be also handledwith flexibility.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention and theadvantages thereof, reference is now made to the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective drawing showing a constitutive example of thedefective correction system 10 of the CCD camera 1 of the conventionalexample;

FIG. 2 is a flowchart showing a recording example of a defective pixelin the defective correction system 10 of the conventional example;

FIG. 3 is a block diagram showing an example of the solid state imagedevice 100 as one embodiment of the present invention;

FIG. 4 is a flowchart showing an example of operation of the solid stateimage device 100 of the present invention;

FIG. 5 is a block diagram for one channel showing a constitutive exampleof 3 CCD camera 200 as an example of the present invention;

FIG. 6 is a conceptual drawing showing an assigned example of writingarea in the EEPROM 26 of the present invention;

FIGS. 7A and 7B are conceptual drawings showing an example of cursordisplay in an example of the cross hair key 28 and the liquid displaymonitor 33 of the present invention;

FIG. 8 is a block diagram showing a constitutive example of defectivecorrection LSI 25 and its peripheral circuit of the present invention;

FIG. 9 is a block diagram showing an example of internal constitution ofthe correction block 57 of the present invention; and

FIG. 10 is a conceptual drawing showing an example of cursor multiplecolors display in the liquid display monitor during Description of thePreferred Embodiments manual writing mode of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Subsequently, one embodiment of a solid state image device and itsdefective pixel image recording method of the present invention will bedescribed below with reference to the drawings.

(Example 1)

FIG. 3 is a block diagram showing an example of constitution of thesolid state image device 100 as one embodiment of the present invention.

In this embodiment, the position selection means for selecting theposition of the defective pixel on the screen is provided, thepositional information of the defective pixel selected by manuallyoperating this position selection means is to record in the memorymeans, in the case where a new defective pixel occurred in the solidstate image element after shipping the product, it is so constitutedsuch that correction of the defective pixel occurred postpriorly can bealso handled with flexibility as well as the positional information ofthe defective pixel which is difficult to deal with by the automatedwriting mode can be easily additionally written without using anyspecial writing jig.

The solid state image device 100 of the present invention has the solidstate image means 11, comprises a step of the solid state image elementpij (i=1−N, J=1−M) of N lines in the vertical direction and M pixels inthe horizontal direction being arranged in a matrix shape. Each solidstate image element pij is done so that an image acquisition informationDin is output. The defective detection means 12 is connected to thesolid state image means 11, the defective detection means 12 is done sothat the defective detection means 12 detects the positional informationD1 of the defective pixel occurred in the relevant line of the solidstate image means 11 during selecting the automated writing mode. Here,the automated writing mode is referred to an operation determining thewriting by automated scanning of an acquisition image acquired by thesolid state image means 11 and detecting the position of the defectivepixel.

In this example, in a state where incident light to the solid stateimage means 11 is intercepted, the solid state image means 11 of Nlines×M pixels is line scanned in turn. The defective detection means 12recognizes luminance which each solid state image means 11 has convertedphotoelectorically. Each recognized luminance is compared with thereference luminance previously determined so that, according to thecomparative results, the positional information D1 of the defectivepixel occurred in the relevant line can be detected.

To this defective detection means 12, the display means 14 is connectedthrough the defective correction means 13, the position of the defectivepixel occurred in the solid state image means 11 during selecting themanual writing mode is displayed, and at the same time, the horizontalcursor Ch and the vertical cursor Cv are displayed on the screen aswell. As used herein, the term “manual writing mode” is referred to anoperation which not only manually operates the horizontal cursor Ch inthe vertical direction, but also manually operates the vertical cursorCv in the horizontal direction, and determines writing by superimposingthe intersection of the horizontal cursor Ch and the vertical cursor Cvon the position of the defective pixel.

To this defective correction means 13, the memory means 16 is connectedthrough the information writing and reading means 15, the positionalinformation D1 of the defective pixel occurred in the solid state imagemeans 11 is recorded by the information writing and reading means 15. Inthis example, the writing area from the first line to the Nth line isassigned in the memory means 16 so that the positional information D1 ofthe defective pixel of m pieces portion per one line can be previouslywritten. Thus, the positional information D1 of the defective pixeloccurred on the relevant line of the solid state image means 11 may berecorded in the writing area of the memory means 16 corresponding to therelevant line. The positional information D1 of the defective pixel isrecorded in the memory means 16 during selecting the automated writingmode or the manual writing mode.

To this defective detection means 12, besides the defective correctionmeans 13, the mode selection means 17, the position selection means 18and the information rewriting means 19 are connected through the controlmeans 20. It is operated in the mode selection means 17 so that any oneof the automated writing mode or the manual writing mode is selected,and the mode selection signal S1 is output into the control means 20. Itis manually operated in the position selection means 18 so that theposition of the defective pixel on the screen of the display means 14 isselected, and the position selection signal S2 is output into thecontrol means 20.

In the information rewriting means 19, it is operated so that thepositional information D1 of the defective pixel recorded in the memorymeans 16 is deleted and the positional information D1 is rewritten, andthe rewriting signal S3 is output into the control means 20. In thecontrol means 20, the defect detection control information D2, thedefect correction control information D3 and the writing and readingcontrol information D4 are occurred based on the mode selection signalS1, the position selection signal S2 and the rewriting signal S3, thedefect detection means 12 is controlled based on the defect detectioncontrol information D2, the defect correction means 13 is controlledbased on the defect correction control information D3, and theinformation writing and reading means 15 is controlled based on thewriting and reading control information D4.

In the above described information writing and reading means 15, whenthe automated writing mode is selected, it is operated so that thepositional information D1 of the defective pixel detected by the defectdetection means 12 based on the writing and reading control informationD4 is recorded in the writing area of the memory means 16 correspondingto the relevant line, and during its correction, the positionalinformation D1 of the defective pixel is read out from the writing area.When the manual writing mode is selected, it is performed so that thepositional information D1 of the defective pixel selected by theposition selection means 18 is recorded in the writing area of thememory means 16 corresponding to the relevant line, and during itscorrection, the positional information D1 is read out from the writingarea.

The defect correction means 13 is connected to this information writingand reading means 15, and as for the image acquisition information Dinof the defective pixel recorded in the memory means 16, it is performedso that at least the image acquisition information Din of the defectivepixel is interpolated based on the image acquisition information Din ofwhich locations are in front and in the rear of the defective pixel dueto the solid state image means. The image output information Dout afterinterpolation is output into the display means 14 and the othercircuits.

Subsequently, as for the defective pixel recording method of the solidstate image device 100 of the present invention, an example of anoperation will be described below. FIG. 4 is a flowchart showing anexample of an operation of the solid state image device 100.

In this embodiment of the present invention, the solid state image means11 of N lines in the vertical direction and M pixels in the horizontaldirection is a recording method of the defective pixel in the solidstate image device 100 arranged in a matrix shape, the position of thedefective pixel occurred in the solid state image means 11 is displayedon the screen, the position of the defective pixel displayed on thisscreen is manually operated and selected, and supposing the case wherethe positional information D1 of the defective pixel selected here isrecorded in the memory means 16.

Moreover, when the positional information D1 of the defective pixel isrecorded in the memory means 16, the writing area from the first line tothe Nth line is prepared in the memory means 16 so as to previouslywrite the defective pixel of m pieces portion per one line, andsubsequently, the case where the positional information D1 of thedefective pixel occurred on the relevant line of the solid state imagedevice 11 is recorded in the writing area of the memory means 16corresponding to the relevant line will be cited.

On the premise of this, in the case where the positional information D1of the defective pixel newly occurred, first, the writing mode of thepositional information D1 of the defective pixel in the step A1 of theflowchart shown in FIG. 4 is set. At this moment, in a state whereincident light to the solid state image means 11 is intercepted, theposition of the defective pixel occurred in the solid state image means11 is displayed by the display means 14 on the screen.

As for the method of interception of incident light to the solid stateimage means 11, for example, the interception is performed such thatiris of the solid state image device 100 is closed. Subsequently,transfer to the step A2, the positional information D1 of the defectivepixel is recorded corresponding to the case where the manual writingmode is set and the case where the automated writing mode is set.

-   (1). A case where the manual writing mode is set:

In order that the position of the defective pixel displayed on thescreen should be chosen by an operator, transfer to the step A3, thehorizontal cursor Ch and the vertical cursor Cv are displayed at thesame time on the screen of the display means 14. Subsequently, in thestep A4, whether or not the positional information D1 of the defectivepixel of m pieces portion per one line is recorded in the memory means16 is determined. At this moment, whether the record of the positionalinformation D1 of one line is present or absent is determined byaccessing the writing area from the first line to the Nth line.

In the case where the positional information D1 of the defective pixelof m pieces portion per one line is not recorded in the memory means 16,transfer to the step A6, in order that the position of the defectivepixel should be chosen by an operator, in the display means 14, not onlythe horizontal cursor Ch is manually operated in the vertical direction,but also the vertical cursor Cv is manually operated in the horizontaldirection due to the output of the position selection means 18 which isoperated by the operator.

Then, when the operator superimposes the intersection of the horizontalcursor Ch and the vertical cursor Cv on the position of the defectivepixel, the determination button of the position selection means 18 ispressed in order to determine the writing in the step A7. Subsequently,in the step A11, the positional information D1 of a new defective pixelis recorded in the memory means 16.

It should be noted that in the case where the positional information D1of the defective pixel of m pieces per one line is recorded in thememory means 16 in the step A4, the step transferres to the step A5, andwhether or not the positional information D1 of the defective pixelrecorded in the memory means 16 is determined. In the case where thelarger defective pixel than the defective pixel recorded in the memorymeans 16 is found out, the positional information of the defective pixelrecorded in the memory means 16 is deleted. This is for the purpose ofwriting the positional information D1 of a new defective pixel insteadof the old positional information D1.

Subsequently, transfer to the step A6, in order that the position of thedefective pixel should be selected by an operator, the operator manuallyoperates the vertical cursor Cv in the horizontal direction. Then, whenthe operator superimposes the intersection of the horizontal cursor Chand the vertical cursor Cv on the position of the defective pixel, thedetermination button is pressed in order to determine the writing in thestep A7 and whereby the old positional information D1 can be rewrittento the positional information D1 of a new defective pixel in the stepA11.

-   (2). A case where the automated writing mode is set:

In order to automatically detect a defective pixel, transfer to the stepA8, the solid state image means 11 of N lines×M pixels is in turnline-scanned and the defect detection means 12 recognizes the luminancewhich the respective solid state image means 11 have convertedphotoelectrically. Subsequently, transfer to the step A9, eachrecognized luminance is compared with the reference luminance previouslypredetermined. The positional information D1 of the defective pixeloccurred on the relevant line is detected corresponding to thiscomparison results.

Here, in the case where each luminance due to the solid state imagemeans 11 is larger than the reference luminance previously set, transferto the step A10, whether or not the positional information D1 of thedefective pixel of m pieces per one line is already recorded in thememory means 16 is detected.

In the case where the positional information D1 of the defective pixelof m pieces is already recorded in the memory means 16, transfer to thestep A12. In the case where the positional information D1 of thedefective pixel of m pieces is not recorded in the memory means 16,transfer to the step A11, and the positional information D1 of a newdefective pixel is recorded in the memory means 16. In the case whereeach luminance due to the solid state image means 11 is smaller than thereference luminance previously set, transfer to the step A12, whether ornot the writing of the positional information D1 of the defective pixelis entirely completed is determined. In the case of the manual writingmode, the termination indication from the operator is detected and thenthe writing operation is terminated. In the case of the automatedwriting mode, the termination of the line scanning is detected and thenthe writing operation is terminated. In the case where the writing ofthe positional information D1 of the defective pixel is not entirelycompleted, return to the step A2, and the process from the step A3 tothe step A11 will be continued.

Accordingly, in the case where a new defective pixel is occurred afterthe shipping of the product of the refined solid state image means 11,the positional information D1 of the defective pixel which is difficultto deal with by the automated writing mode can be easily written in thememory means 16, for example, in the service section without using anyspecial writing jig.

In this embodiment of the present invention, although the case where theimage acquisition information Din of one channel portion is imageprocessed has been described above, off course, it can be applied to thethree channel process systems outputting the image acquisitioninformation Dout of red (R), green (G) and blue (B) using 3 CCD camera.

(Example 2)

FIG. 5 is a block diagram of one channel portion showing an example ofconstitution of a 3 CCD camera as one embodiment of the presentinvention. In this example, the defect detection means 12 shown in FIG.3, the defect correction means 13 and the information writing andreading means 15 are integrated into one of the defect correction LSI25, it is constructed so that the digital picture image signal Din ispassed through, detection of the solid state image element array 21 ofthe defective pixel (flaw) shown in FIG. 5, its correction and cursordisplay is made perform within the identical LSI, and it is made capableof apply to a variety of models of CCD cameras.

In FIG. 5, although 3 CCD camera 200 has three solid state image means11 outputting image acquisition information for red, green and blue(hereinafter, referred to as digital picture image signal Din), in thisexample, a case of the solid state image means 11 outputting the digitalpicture image signal Sin for red will be cited as one example anddescribed below.

The solid state image means 11 has the solid state image element array21, CDS (Co-related Double Sample-hold) circuit 22, AGC (Auto-GainControl) circuit 23 and the analog/digital conversion circuit(hereinafter, referred to as A/D conversion circuit) 24.

The solid state image element array 21 is consisted of solid state imageelements Pij (i=1−N, j=1−M) of N lines in the vertical direction and Mpixels in the horizontal direction being arranged in a matrix shape. InNTSC method, the number of N is 480 lines, the number of M is 640pixels. The CDS circuit 22 is connected to the solid state image elementarray 21, and the noises are removed from the image acquisition signalSin. The AGC circuit 23 is connected to the CDS circuit 22, and it isconstructed so that the gain of the image acquisition signal Sin isadjusted. The A/D conversion circuit 24 is connected to the AGC circuit23, and the digital picture image signal (image acquisition information)Din after the image acquisition signal Sin is A/D converted) is output.

The defect correction LSI 25 is connected to the A/D conversion circuit24, and it is constructed so that the positional information D1 of thedefective pixel occurred on the relevant line of the solid state imageelement array 21 during selecting the automated writing mode. The defectcorrection LSI 25 is a circuit in which the defect detection means 12,the defect correction means 13, the information writing and readingmeans 15 and the timing occurrence means (not shown) and the like areintegrated into one of IC chips. In this example, in a state where anincident light to the solid state image element array 21 is intercepted,the solid state image element array 21 of 480 lines×640 pixels is inturn line-scanned. The defect correction LSI 25 recognizes luminanceinformation according to the respective solid state image means 11. Therespective recognized luminance are compared with the referenceluminance previously set, so that the positional information D1 of thedefective pixel occurred on the relevant line can be detectedcorresponding to this comparison results.

A non-volatile memory is connected to this defective correction LSI 25as a memory means, and the positional information D1 of the defectivepixel occurred in the solid state image element array 21 is recordedbased on the memory control signal Sm. A parallel type EEPROM 26 is usedfor a non-volatile memory. This type is used because it enablesinformation writing and reading and is suitable for a high-speedperformance.

Moreover, a microcomputer (hereinafter, referred to as microprocessor)30 for control besides the EEPROM 26 is connected to the defectivecorrection LSI 25 shown in FIG. 5, and the mode selection switch 27, thecross hair key 28 with the determination button and the ten-key numeralpad 29 are connected to this microprocessor 30. An input tool for use ina conventional camera acquisition operation is used for both of thecross hair key 28 and the ten-key numeral pad 29. The switch 27 for modeselection is an example of mode selection means, it is operated so thateither of the automated writing mode or the manual writing mode isselected, and the mode selection signal S1 is output into themicroprocessor 30. For example, the mode selection signal S1 of a highlevel indicating the automated writing mode is output by turning on theswitch 27, and the mode selection signal S1 of a low level indicatingthe manual writing mode is output by turning-off the switch 27.

The cross hair key 28 with the determination button is an example ofposition selection means, it is manually operated so that the defectivepixel is selected on the screen of the liquid crystal display monitor33, and the position selection signal S2 is output into themicroprocessor 30. The ten-key numeral pad 29 is an example ofinformation rewriting means, and has numeral keys from “0” to “9”, “*”key and “#” key. For example, the positional information D1 which isrecorded in the EEPROM 26 and is of the defective pixel of the solidstate image means 11 for red color is deleted by “*” key, the numeralkey of “1” is operated so that the positional information D1 of thedefective pixel is rewritten, and the rewriting signal S3 is output intothe microprocessor 30. Similarly, in the case where the positionalinformation D1 of the defective pixel of the solid state image means 11for green color is rewritten, the numeral key of “2” is operated. And inthe case where the positional information D1 of the defective pixel ofthe solid state image means 11 for blue color is rewritten, the numeralkey of “3” is operated.

In the microprocessor 30, the defect detection control information D2,the defect correction information D3 and the writing and reading controlinformation D4 are occurred base on the mode selection signal S1, theposition selection signal S2 and the writing signal S3, and the defectcorrection LSI 25 is controlled based on the defect detection controlinformation D2, the defect correction LSI 25 is controlled based on thedefect correction control information D3 and the writing and readingcontrol information D4.

In this defect correction LSI 25, in the case where the automatedwriting mode is selected, the positional information D1 of the defectivepixel is recorded in the writing area of the EEPROM 26 corresponding tothe relevant line on the basis of the writing and reading controlinformation D4, and it is operated so that the positional information D1of the defective pixel is read out from the writing area during itscorrection. In the case where the manual writing mode is selected, thepositional information D1 of the defective pixel selected by the crosshair key 28 with the determination button is recorded in the writingarea of the EEPROM 26 corresponding to the relevant line and thepositional information D1 is read out from the writing area during itscorrection.

Moreover, In the defect correction LSI 25, as for the digital pictureimage signal Din of the defective pixel recorded in the EEPROM 26, it isoperated so that at least the digital picture image signal Din of thedefective pixel is interpolated on the basis of the digital pictureimage signal Din due to the solid state image element array 21 in frontand in the rear of the defective pixel. The digital signal processor(hereinafter, referred to as DSP) 31 besides the EEPROM 26 and themicroprocessor 30 to this defect correction LSI 25, and the digitalpicture image signal Dout after the interpolation is signal processed.

The digital/analog conversion circuit (hereinafter, referred to as D/Aconversion circuit) 32 is connected to this DSP 31, and the digitalpicture image signal Dout is converted into the analog picture imagesignal Sout. The liquid crystal display monitor 33 is connected to theD/A conversion circuit 32 as a display means, and the position of thedefective pixel occurred in the solid state image element array 21during selecting the manual writing mode is not only displayed on thescreen on the basis of the analog picture image signal Sout, but alsothe horizontal cursor Ch and the vertical cursor Cv are displayed at thesame time as well.

On the screen of this liquid display monitor 33, the horizontal cursorCh is operated in the vertical direction on the basis of the positionselection signal S2 occurred by operating the cross hair key 28 with thedetermination button, and the vertical cursor Cv is operated in thehorizontal direction on the screen. It is operated so that thedetermination button is pressed of the cross hair key 28 at theintersection of this horizontal cursor Ch and the vertical cursor Cv. Itshould be noted that the analog picture image signal Sout after D/Aconversion is also output into the other circuits.

Subsequently, an example of assignment of the writing area of thepositional information D1 in the EEPROM 26 will be described below. FIG.6 is a conceptual diagram showing an example of assignment of thewriting area in the EEPROM 26.

In this example, in order to previously write positional information D1of defective pixel of two pierces per one line the line shown in FIG. 6is assigned in the EEPROM 26, and it is performed so that the positionalinformation D1 of the defective pixel occurred on the relevant line ofthe solid state image element array 21 is recorded in the writing areaof the EEPROM 26 corresponding to the relevant line.

In this example, in order to record the positional information D1 of thedefective pixel of one piece, two bites are assigned. The bitinformation of “FRGB” as a upper order address and the horizontalposition bit B11-B8 are written in byte 1 shown in FIG. 6. Thehorizontal position bit B7-B0 as a lower order address is written in bit2. F flag is a bit information indicating a defective data written atthe time of shipping from the factory. R, G and B flags are bitinformation indicating channels (any one of the solid state image means11 for red color, green color and blue color) generating a defectivepixel in the 3 CCD camera 200, and the horizontal position bit B0-B11 isa linear address of 12 bits indicating the horizontal positioninformation Dh of the defective pixel. The number of the horizontalpixels is 4096 at the maximum. The positional information D1 of thedefective pixel is recorded in the EEPROM 26 during selecting theautomated writing mode or the manual writing mode.

Subsequently, an example of the cursor display and an example of anoperation of the cross hair key 28 in the liquid crystal display monitor33 will be described below. For example, the cross hair key 28 shown inFIG. 7 has not only the determination button 28E in the center, but alsohas the triangular key facing rightward 28A, the triangular key facingleftward 28B, the triangular key facing upward 28C and the triangularkey facing downward 28D.

When the triangular key facing rightward 28A is pressed, it is operatedso that the vertical cursor Cv is moved to the right direction on thescreen of the liquid crystal display monitor 33 shown in FIG. 7, andwhen the triangular key facing leftward 28B is pressed, it is operatedso that the vertical cursor Cv is moved to the left direction on thescreen. Moreover, when the triangular key facing upward 28C is pressed,it is operated so that the horizontal cursor Ch is moved to the upperdirection, and when the triangular key facing downward 28D is pressed,it is operated so that the horizontal cursor Ch is moved to the lowerdirection. Accordingly, for example, the vertical cursor Cv and thehorizontal cursor Ch can be overlapped at the defective pixel Pij whichis white and bright. In this state, when the determination button 28E ispressed, the writing of the position of the defective pixel to theEEPROM 26 can be determined.

Subsequently, an example of an internal constitution of the defectcorrection LSI 25 will be described below. The defect correction LSI 25shown in FIG. 8 has the serial communication block 51, the memorycontroller block 52, the timing generation block 53, the data writingand reading block 55, the correction signal generation block 56 and thecorrection block 57.

The serial communication block 51 is connected to the microprocessor 30for control described above, and it is operated so that a serialcommunication is performed with the microprocessor 30 and various kindsof control signals Sc are output into the memory controller block 52 andthe timing generation block 58. The control signal Sc is generated bydecoding the defect detection control information D2, the defectcorrection control information D3 and the writing and reading controlinformation D4, which have been transferred from the microprocessor 30.

In the timing generation block 53, various kinds of timing signals usedin an internal LSI on the basis of synchronous signal input into therelevant defect correction LSI 25. For example, the vertical positioninformation Dv and the data writing and reading signal WE are generatedon the basis of the synchronous signal S4. The horizontal positioninformation Dh is output into the correction signal generation block 56,the horizontal position information Dh and the vertical positioninformation Dv are output into the memory controller block 52 and thecorrection block 57, and the data writing and reading signal WE isoutput into the data writing and reading block 55.

Moreover, the memory controller block 52 is connected to the serialcommunication block 51, and it is operated so that the memory controlsignal Sm and the address are output into the EEPROM 26 on the basis ofthe defect determination signal Se, the control signal Sc, thehorizontal position information Dh and the vertical position informationDv, the writing control of the positional information D1 of thedefective pixel is performed, and its reading control is performed. Thedefect determination signal Se is obtained on the basis of thedetermination results which compare the reference value Dr and thedigital picture image signal (image acquisition information) Din forthree color display of R, G and B in the correction block 57constituting the defect detection means, and obtained at the time whenthe position of the defective pixel of the solid state image elementarray 21 is detected.

The digital picture image signal Din for three colors display isclassified into G data input and B data input and supplied from each ofthe A/D conversion circuit 24 to the correction block 57.

The data writing and reading block 55 is an example of an informationwriting and reading means, it is operated so that the positionalinformation D1 at the time when writing to the EEPROM 26 on the basis ofthe writing and reading signal WE is held for a while and the positionalinformation D1 at the time when reading from the EEPROM 26 is held for awhile. The correction signal generation block 56 is connected to thedata writing and reading block 55, and it is operated so that the defectcorrection signal (defect correction pulse) Sr, Sg and Sb for threecolors display for R, G, and B are generated on the basis of theposition information D1 due to the data writing and reading block 55 andthe horizontal position information Dh from the timing generation block53.

The correction block 57 constituting the defect correction means as wellis connected to this correction signal generation block 56, and it isoperated so that when the defect correction signals Sr, Sg and Sb of R,G and B respectively are input, straight line interpolation data forthree colors display of R, G and B is generated on the basis of frontvalue and the rear value of the defective pixel of the digital pictureimage signal Din. The straight line interpolation data is generated forR correction output, G correction output and B correction output. Adigital picture image signal Dout comprising R correction output fromthis correction block 57 to the liquid crystal display monitor 33, Gcorrection output and B correction output is output.

Subsequently, an example of an internal constitution of the correctionblock 57 of the defect correction LSI 25 will be described below. Thecorrection block 57 shown in FIG. 9 constitutes the digital picturesignal pass circuit by the solid state image means 11 for red color, andsimply consisted of 5 pieces of the resisters 71-73, 75 and 79, 2 piecesof the data selectors 77, 78, 2 pieces of the adders 76, 710, one pieceof the comparator 74 and the cursor generation section 711. As for thedigital picture image signal pass circuit of the solid state image means11 for green and blue color, because it takes the same constitution withthe digital picture image signal pass circuit of the solid state imagemeans 11 for red color, description for it is omitted.

In this example, as for the correction method of a defective pixel,supposing that the digital picture image signal Din of a defective pixelis replaced with mean value of left and right pixel of the defectivepixel. It should be noted that although correction methods themselves ofa defective pixel of a variety of methods further referring to upper andlower pixels and diagonal pixels are known, the present invention is notlimited to these correction methods.

In the correction block 57 shown in FIG. 9, 3 pieces of the register71-73 are cascaded (subordinately). Specifically, it is operated so thatan output O of the first register 71 is connected to an input D of thesecond register 72, an output O of the register 72 is connected to aninput D of the third register 73, and when the digital picture imagesignal Din is input into the register 71, the three pixels portionconsecutive to the horizontal direction is held at the same time in 3pieces of the registers 71-73.

The comparator 74 is connected to the output O of this register 72, whenthe automated writing mode is performed, luminance value of the centralpixel and the reference value Dr input as a threshold value arecompared, and whether or not the digital picture image signal Din due tothe relevant pixel is the digital picture image signal Din due to thedefective pixel is determined. The register 75 is connected to thecomparator 74, in the case where the relevant digital picture imagesignal Din is due to a defective pixel, a defect determination signal Seindicating that the defective pixel is detected is held.

Since this defect determination signal Se is output into the memorycontroller block 52, described in FIG. 8, it is operated so that in thememory controller block 52 the horizontal and vertical counter valuesare held on the basis of the defect determination signal Se, and thepositional information D1 of the defective pixel is written in theEEPROM 26 on the basis of this.

Moreover, it is operated so that an output O of register 71 is not onlyconnected to an input b of the adder 76, an output O of the register 73is connected to an input a of the adder 76 as well, and the mean valueof both lateral pixels of the central pixel is always output. It isoperated so that an output of the adder 76 is connected to an input a ofthe data selector 77, an output O of the register 72 is connected to aninput b of the data selector 77, and any one of an output of the adder76 or an output of the register 72 is selected on the basis of thedefect correction signal Sr input from the correction signal generationblock 56. It should be noted that in the automated writing mode a defectcorrection signal Sr is stopped and if there is a defective pixel,immediately it becomes such a state that the digital picture imagesignal Dout of the defective pixel is output from the data selector 77.

The correction signal generation block 56 is connected to a controlinput S of this data selector 77, and it is operated so that when thedigital picture image signal Din of the defective pixel is just heldduring correction operation, a defect correction signal Sr is generated.For example, in the correction signal generation block 56, a defectcorrection signal Sr is generated by comparing the horizontal andvertical counter values synchronized with the digital picture imagesignal Din and the positional information D1 from the EEPROM 26. At thismoment, the data selector 77 selecting the central pixel side b so faris switched to the average value side a on the basis of a defectcorrection signal Sr, whereby the data selector 77 will output thedigital picture image signal Dout instead of the digital picture imageDout of the defective pixel and adjusted.

An input a of the adder 710 is connected to an output of the dataselector 77, a cursor display luminance signal S5 is supplied to aninput b of this adder 710, and it is operated so that a cursor displayluminance signal S5 is superimposed on the digital picture image signalDout of the defective pixel. Moreover, an input a of the second dataselector 78 is connected to an output of the data selector 77, and aninput b of the data selector 78 is connected to this adder 710 it isoperated so that any one of a digital picture image signal Dout of thedefective pixel superimposed on a cursor display luminance signal S5based on a cursor display pulse S6 or a digital picture image signalDout after correction but without superimposing on a cursor displayluminance signal S5 is selected.

The adder 710 provided between the data selector 77 and the dataselector 78 may be omitted. In the case where the adder 710 is provided,even if a white and bright defective pixel and the horizontal cursor Chand the vertical cursor Cv are superposed, the position of the defectivepixel can be clearly indicated. In the case where the adder 710 is notprovided, at the time when the horizontal cursor Ch and the verticalcursor Cv are superimposed on a white and bright defective pixel, it isoperated so that the display due to the defective pixel is deleted. Itcan be an index determining whether or not the horizontal cursor Ch andthe vertical cursor Cv are superimposed on the defective pixel.

The cursor generation section 711 is connected to a control input S ofthe data selector 78, and a cursor display pulse S6, which synthesizes ahorizontal cursor display signal generated by comparing the registervalue indicating the position of the horizontal cursor Ch and a verticalcounter value synchronous with a digital picture image signal Din, isgenerated. An output of the adder 76 or an output of the register 72 isselected by this cursor display pulse S6. In the timing generationsection 53, the horizontal counter value and the vertical counter valueare obtained on the basis of a control signal Sc decoding a defectdetection control information D2 sent to the serial communication block51, a horizontal position information Dh and a vertical positioninformation Dv occurred in the timing generation block 53. It should benoted that it will be good that the cursor generation section 711 isincorporated together inside of the timing generation section 53.

Subsequently, a cursor display signal S5 can be superimposed on thepicture image by switching the data selector 78 due to the cursordisplay pulse S6. In this case, the intersection of the horizontalcursor Ch and the vertical cursor Cv is superimposed on the position ofthe defective pixel by the manual operation using the cross hair key 28with the determination button, and the when determination button 28E ispressed, then, the register value in the cursor generation section 711at the time indicates the position of the defective pixel, therefore,the positional information D1 of the defective pixel can be written inthe EEPROM 26 on the basis of this register value.

Subsequently, an example of cursor display during the manual writingmode extended for three channels of R, G and B will be described below.The display positions of the horizontal cursor Ch and the verticalcursor Cv shown in FIG. 10 can be moved upward and downward, andleftward and rightward on the basis of a cursor display luminance signalS5 and a cursor display pulse S6 due to the cursor generation section711, and the positional information D1 (correction data) of thedefective pixel can be additionally written by superimposing theintersection of the cursors on the white and bright defective pixel thatthe operator wants to adjust and sending a writing command.

As for this example, this is a case where picture images are dividedinto three of red, green and blue colors concerning with the solid stateimage element array 21 and acquired, the horizontal cursor Ch operatedin the vertical direction on the screen of the liquid display monitor 33is displayed in white and the vertical cursor Cv operated in thehorizontal direction on the screen is displayed in red, green or bluecolor.

In this example, the writing operation of the positional information D1of the defective pixel is performed at every one channel. Therefore, RGBflag for channel designation is provided in upper address shown in FIG.6 as a control command. For example, when flagging R flag and enteringinto the manual writing mode, as for the vertical cursor Cv operated inthe horizontal direction on the screen of the liquid display monitor 33,correction point marker Cr of red color is lighted and displayed in thecase of the position of the defective pixel of red color alreadyrecorded in the EEPROM 26.

As for the position of the defective pixel of red color to be recordedin the EEPROM 26 from now on, in order to distinguish from the markerCr, the vertical cursor Cv is lighted and displayed in red color. Greenand blue colors are also similarly lighted and displayed or flickeredand displayed. In this way, since the horizontal and vertical cursorsthemselves have channel display function, the position of the defectivepixel is easily retrieved.

Subsequently, an example of an operation of the defective pixelrecording method of the 3 CCD camera 200 of the present invention willbe described below. It should be noted that a flowchart of an example ofan operation of the solid state image device 100 shown in FIG. 4 will beagain referred to.

In this example, supposing a case of a recording method of a defectivepixel in the 3 CCD camera for red, green and blue colors, in which thesolid state image element Pij of 480 lines in the vertical direction and640 pixels in the horizontal direction is arranged in a matrix shape,and in which the position of the defective pixel occurred in therespective solid state image means 11 for red, green and blue colors isdisplayed in time dividing on the screen, the position of the defectivepixel displayed on the screen is manually operated and selected and thepositional information D1 of the defective pixel selected here isrecorded in the EEPROM 26.

Moreover, a case is cited in which, at the time when the positionalinformation D1 of the defective pixel is recorded in the EEPROM 26, thewriting area from the first line to the 480^(th) line is prepared in theEEPROM 26 so that 2 pieces portion of the defective pixels per one lineis previously written, and subsequently, for example, the positionalinformation D1 of the defective pixel occurred on the relevant line ofthe solid state image means 11 for red color is recorded in the EEPROM26 corresponding to the relevant line.

On the premise of this, in the positional information D1 of thedefective pixel newly occurred is recorded, first, the writing mode isset using the mode selection switch 27 shown in FIG. 5 in the step A1 ofthe flowchart shown in FIG. 4. At this instance, in a state where anincident light to the relevant 3 CCD camera 200 is intercepted, theposition of the defective pixel occurred in the solid state image means11 for red color is displayed on the screen by the liquid crystaldisplay monitor 33. Subsequently, transfer to the step A2, thepositional information D1 of the defective pixel is recorded in theEEPROM 26 corresponding to the case where the manual writing mode isset, and the case where the automated writing mode is set.

-   (1). A case where the manual writing mode is set:

In order that the position of the defective pixel displayed on thescreen should be selected by an operator, transfer to the step A3, thehorizontal cursor Ch and the vertical cursor Cv are displayed at thesame time on the screen of the liquid crystal display monitor 33. Inthis manual writing mode, in the correction block 57 shown in FIG. 9,when the digital picture image signal Din is input into the register 71,it is operated so that the digital picture image signal Din of 3 pixelsportion consecutive in the horizontal direction is held in 3 pieces ofthe registers 71˜73. In the adder 76, it is constituted so that theaverage value of both lateral pixels of the central pixel is alwaysoutput, but in the manual writing mode, a defective correction signal Sris stopped, and if there is a defective pixel, immediately it becomes toa state where the digital picture image signal Dout of the defectivepixel is output into the data selector 77.

Furthermore, in the adder 710, it is operated so that a cursor displayluminance signal S5 is superimposed on the digital picture image signalDout of the defective pixel, whereby in the manual writing mode, thehorizontal cursor Ch and the vertical cursor Cv are superimposed on thedigital picture image signal Din and can display it.

Subsequently, in the step A4, whether or not the positional informationD1 of the defective pixels of 2 pieces per one line is recorded in theEEPROM 26 is determined. At this moment, whether the positionalinformation D1 of one line is present or not is determined by accessingthe writing area from the first line to the 480th line.

In the case where the positional information D1 of the defective pixelsof 2 pieces portion per one line is not recorded in the EEPROM 26,transfer to the step A6, in order that the position of the defectivepixel should be made selected, according to an output of the cross hairkey 28 with the determination button operated by the operator, not onlythe horizontal cursor Ch is manually operated in the vertical directionand but also the vertical cursor Cv is manually operated in thehorizontal direction.

Then, when the operator superimposes the intersection of the horizontalcursor Ch and the vertical cursor Cv on the position of the defectivepixel, the determination button 28E of the cross hair key 28 is pressedin order to determine the writing in the step A7. Subsequently, thepositional information D1 of a new defective pixel is recorded in theEEPROM 26.

It should be noted that, in the step A4, in the case where thepositional information D1 of the defective pixels of 2 pieces per oneline is already recorded in the EEPROM 26, transfer to the step A5, andwhether or not the positional information D1 of the defective pixelrecorded in the EEPROM 26 is determined. In the case where a defectivepixel larger than the defective pixel recorded in the EEPROM 26 is foundout, the positional information D1 of the defective pixel recorded inthe EEPROM 26 is deleted. This is for the purpose of the positionalinformation D1 of a new defective pixel instead of the old positionalinformation D1 is written.

Subsequently, transfer to the step A6, in order that the position of thedefective pixel should be selected, the operator manually operates notonly the horizontal cursor Ch in the vertical direction, and manuallyoperates but also the vertical cursor Cv in the horizontal direction.Then, when the operator superimposes the intersection of the horizontalcursor Ch and the vertical cursor Cv on the position of the defectivepixel, in the step A7, the determination button 28E is pressed in orderto determine the writing, whereby in the step A11, the old positionalinformation D1 can be rewritten into the positional information D1 of anew defective pixel.

-   (2). A case where the automated writing mode is set:

In order to automatically detect a defective pixel, transfer to the stepA8, the solid state image means 11 for red color of 480 lines ×640pixels is in turn line-scanned by the correction block 57, and theluminance which the respective solid state image means 11 have convertedphotoelectrically is measured. Subsequently, transfer to the step A9,respective luminance due to the solid state image means 11 are comparedwith the reference value Dr previously set. The positional informationD1 of the defective pixel occurred on the relevant line is detectedcorresponding to the comparative results. Here, in the case where therespective luminance is larger than the reference value Dr previouslyset, transfer to the step A10, and whether or not the positionalinformation D1 of the defective pixels of 2 pieces per one line isalready recorded in the EEPROM 26 is detected.

In the case where the positional information D1 of the defective pixelsof 2 pieces is already recorded in the EEPROM 26, transfer to the stepA12. In the case where the positional information D1 of the defectivepixels of 2 pieces is not recorded in the EEPROM 26, transfer to thestep A11, the positional information D1 is recorded in the EEPROM 26.

At this moment, in the correction block 57, when the digital pictureimage signal Din is input into the register 71, it is operated so thatthe digital picture image signal Din of the 3 pieces portion consecutivein the horizontal direction in the 3 pieces of the register 71-73. Inthis automated writing mode, whether or not the digital picture imagesignal Din due to the relevant pixel is the digital picture image signalDin due to the defective pixel is determined by comparing luminancevalue of the central pixel and the reference value Dr. In the case wherethe relevant digital picture image signal Din is due to defective pixel,a defect determination signal Se indicating that the defective pixel isdetected is held.

Since this defect determination signal Se is output into the memorycontroller block 52 shown in FIG. 8, it is operated so that in thememory controller block 52, the horizontal and vertical counter valuesare held on the basis of the defect determination signal Se, and thepositional information D1 of the defective pixel is written in theEEPROM 26 on the basis of this. It should be noted that in the automatedwriting mode, the defect correction signal Sr is stopped, if there is adefective pixel, immediately it becomes a state where the digitalpicture image signal Dout of the defective pixel is output from the dataselector 77.

Moreover, the respective luminance due to the solid state image means 11for red color is smaller than the reference value Dr previously set,transfer to the step A12, whether or not the writing of the positionalinformation D1 of the defective pixel is entirely completed isdetermined. In the case of the manual writing mode, the terminationinstruction from the operator is detected and the writing operation isterminated. In the case of the automated writing mode, the terminationof the line scanning is detected, and the writing operation isterminated. In the case where the positional information D1 of thedefective pixel is not entirely completed, return to the step A2, theprocess of the step A3˜A11 will be continued.

As for the correction process of the defective pixel, in the correctionblock 57 shown in FIG. 9, when the digital picture image signal Din isinput into the register 71, it is operated so that the digital pictureimage signal Din of 3 pixels consecutive in the horizontal direction inthe 3 pieces of the register 71˜73. In the adder 76, it is operated sothat the average value of both of lateral pixels of the central pixel isalways output. In the first data selector 77, it is operated so thateither of an output of the adder 76 or an output of the register 72 isselected on the basis of the defective correction signal Sr.

When the digital picture image signal Din of the defective pixel is justheld in the register 72 during correction operation in the data selector77, it is operated so that the defect correction signal Sr is generatedin the correction signal generation block 56. At this instance, in thecorrection signal generation block 56, the defect correction signal Sris generated by comparing the horizontal counter value and the verticalcounter value which are synchronized with the digital picture imagesignal Din and the positional information D1 from the EEPROM 26.

The data selector 77 selecting the central pixel side b so far isswitched to the average value side a on the basis of the defectcorrection signal Sr, whereby the data selector 77 will output thedigital picture image signal Dout adjusted and instead of the digitalpicture image signal Dout of the defective pixel. In the second dataselector 78, it is operated so that the digital picture image signalDout not superimposing on the cursor display luminance signal S5 as itis after correction is selected on the basis of the cursor S6.Accordingly, in the case where an image acquisition information due to ared and bright defective pixel is included in the digital picture imagesignal Sin, the digital picture image signal Dout removing the imageacquisition information due to the defective pixel from the pictureoutput information by the correction operation can be output.

In this way, in the present embodiment of the present invention, whenthe defect correction system is made to be an integrated circuit, themanual writing mode besides the automated writing mode is provided,therefore, in the case where a new defective pixel is occurred aftershipping the product of the finely manufactured 3 CCD camera 200, thepositional information D1 can be easily written in the EEPROM 26 fordefective pixel which cannot be dealt with in the automated writing mode(a white and bright pixel such as one repeating flickering periodicallyand a defective pixel which cannot be deleted from the limitation of thedefect correction circuit and the like) without using any specialwriting jig.

Moreover, according to the present embodiment, since all of the defectcorrection, detection and cursor display can be carried out within theidentical defect correction LSI 25, it does not need any severe timingcontrol at all, a defect correction system of self completed type whichis not influenced with certain system delay at all can be constituted.Accordingly, the relevant defect correction system can be easily mountedon various kinds of models of CCD cameras.

In this example, although the case where as for the number of thedefective pixel adjustable per one line, m, the expression m=2 is held,has been described, it is not limited to this, and it will be good thata defect correction system dealing with more than two defective pixelsper one line. Moreover, it will be good that the liquid crystal displaymonitor 33 is embedded within the 3 CCD camera just like a video camera,and it will be also good that it is connected to the outside just likeindustrial camera.

Briefly, the positional information D1 of the defective pixel can bewritten in the EEPROM 26 without using any special jig except a CCDcamera and a monitor. Therefore, the service section can easily dealwith the defective pixel occurred, for example, in the market afterstarting the sales of the cameras. It is not necessary to keep anexclusive jig.

By the way, if a manual writing mode is performed using an exclusive jigin the outside of the 3 CCD camera, defect correction signals Sr, Sg andSb accurately adjusting a system delay portion from the point performingthe correction within its camera to camera output must be prepared. Atthis point, since its correction amount per camera model is defined in aself completed manner according to methods of the present invention, theproblem of owning jointly a common writing jig is also cleared.

As described above, according to solid state image devices of thepresent invention, a position selection means manually operated isprovided so as to select a defective pixel on the screen, and it isoperated so that the positional information selected here is recorded inthe memory means.

Accordingly, in the case where a defective pixel is occurred aftershipping the product of the finely manufactured solid state imageelement, the positional information of the defective pixel can be easilywritten in memory means without using any special jig.

According to defective pixel recording methods of solid state imagedevices of the present invention, the devices are operated so that theposition of the defective pixel occurred in the solid state imageelement is displayed on the screen, after the position of the defectivepixel indicated on the screen is manually operated and selected, thepositional information of the defective pixel selected here is recordedin memory means.

Accordingly, in the case where a defective pixel is occurred aftershipping the product of a finely manufactured solid state image element,the positional information of the defective pixel can be written inmemory means without using any special writing jig. In addition, as forcorrection for a defective pixel occurred posteriorly, it is can behandled with flexibility.

The present invention is extremely preferable to apply it to CCD camerasarranging solid state image elements in a high density and in a matrixshape.

1. A solid state image device in which solid state image elements of Nlines in a vertical direction and M pixels in a horizontal direction arearranged in a matrix shape, said solid state image elements beinggrouped in sets of red, green and blue colored pixels; said solid stateimage device comprising: display means for displaying a position of adefective pixel occurred in said solid state element on a screen, ahorizontal cursor operated in the vertical direction on said screen anddisplayed in white, and a vertical cursor operated in the horizontaldirection on said screen and displayed in red, green or blue based onthe color of the defective pixel at said position and flickering if thedefective pixel is not previously known; position selection means forselecting a position of a defective pixel on a screen of said displaymeans, the position selection means having a manual writing mode and anautomated writing mode; in said automated writing mode the position ofsaid defective pixel is automatically determined by scanning anacquisition image acquired by said solid state image device andcomparing a luminance value for each pixel with a predeterminedluminance value, and memory means for recording positional informationof said defective pixel selected by said position selection means.
 2. Asolid state image device according to claim 1, wherein said positionselection means has, horizontal cursor operated in vertical direction ona screen of said display means, vertical cursor operated in horizontaldirection on said screen, and writing determination button operated soas to be pressed at an intersection of said horizontal cursor andvertical cursor.
 3. A solid state image device according to claim 1,wherein a writing area from first line to the N line is assigned so asto previously write positional information of defective pixels of mpieces portion per one line, and it is performed so that positionalinformation of a defective pixel occurred on the relevant line of saidsolid state image element is recorded in a writing area corresponding tothe relevant line of said memory means.
 4. A solid state image deviceaccording to claim 1, wherein defect detection means for detectingpositional information of a defective pixel occurred on the relevantline of said solid state image element, and information writing andreading means for recording positional information of a defective pixeldetected by said defect detection means in a writing area of said memorymeans corresponding to the relevant line and reading positionalinformation from said writing area are provided.
 5. A solid state imagedevice according to claim 1, wherein information rewriting means fordeleting positional information of a defective pixel recorded in saidmemory means and rewriting the relevant positional information isprovided.
 6. A solid state image device according to claim 1, wherein insaid defect detection means, line scanning in turn a solid state imageelement of N lines and M pixels and measuring luminance by respectivesolid state image element in a state where an incident light to saidsolid state image element is intercepted, comparing respective luminanceby said solid state image element and reference luminance previouslyset, and detecting positional information of a defective pixel occurredon the relevant line corresponding to said comparative results.
 7. Asolid state image device according to claim 1, wherein as for imageacquisition information of a solid state image element of a defectivepixel recorded in said memory means, at least defect correction meansfor interpolating image acquisition information of a solid state imageelement of said defective pixel is provided based on image acquisitioninformation by solid state image elements in front and in the rear ofsaid defective pixel.
 8. A defective pixel recording method in a solidstate image device in which solid state image elements of N lines in avertical direction and M pixels in a horizontal direction are arrangedin a matrix shape, wherein said solid state image elements are groupedin sets of red, green and blue colored pixels; comprising the steps of:displaying a position of a defective pixel occurred in said solid stateimage element on a screen, a horizontal cursor operated in the verticaldirection on said screen and displayed in white, and a vertical cursoroperated in the horizontal direction on said screen and displayed inred, green or blue based on the color of the defective pixel at saidposition and flickering if the defective pixel is not previously known;selecting a position of a defective pixel displayed on said screen,including an automated writing mode in which the position of saiddefective pixel is automatically determined by scanning an acquisitionimage acquired by said solid state image device and comparing aluminance value for each pixel with a predetermined luminance value, andrecording positional information of said selected defective pixel inmemory means.
 9. A defective pixel recording method of a solid stateimage device according to claim 8, wherein when a position of adefective pixel displayed on said screen is selected, displayinghorizontal cursor and vertical cursor on said screen simultaneously,manually operating not only said horizontal cursor in vertical directionand manually operating but also said vertical cursor in horizontaldirection, and determining a writing by superimposing an intersection ofsaid horizontal cursor and vertical cursor on a position of saiddefective pixel.
 10. A defective pixel recording method of a solid stateimage device according to claim 8, wherein when a defective pixel whichis larger than a defective pixel recorded in said memory means, isdetected positional information of a defective pixel recorded in saidmemory means is deleted and rewritten into new positional information.11. A defective pixel recording method of a solid state image deviceaccording to claim 8, wherein when positional information of saiddefective pixel is recorded in memory means, preparing a writing areafrom first line to Nth line in said memory means so as to previouslywrite defective pixels of m pieces portion per one line, andsubsequently, recording positional information of a defective pixeloccurred on the relevant line of said solid state image element in awriting area of said memory means corresponding to the relevant line.